300 W / 168-hour stress test
The source reports a P-core maximum-temperature average of 89.6°C for KT-X9 on an Intel Core i9-14900KS platform running AIDA64.
Platform-specific result; it does not predict temperatures in other cooling systems.
KT-X9 / THERMAL INTERFACE MATERIAL
Heat transfer starts
at the interface.
KT-X9 silicone-free thermal grease addresses thermal impedance, application handling and long-term stability in high-power interfaces. InnoChem supports product selection and application discussions.
SILICONE-FREE / LOW IMPEDANCE / PROCESSABILITY
InnoChem
Material structure study
DRAG TO ROTATE · CONCEPTUAL STRUCTURE, NOT TO SCALE
ENGINEERING DATA
Conductivity and actual contact thermal resistance.
5.5Thermal conductivity · W/m·KHot Disk
0.05Thermal impedance · K·cm²/WASTM D5470 / 40 psi
168 h300 W platform stress testIntel Core i9-14900KS / AIDA64
KT-X9 technical data
Select the test pressure to view the reported thermal impedance.
| Property | Value / characteristic | Method / conditions |
|---|---|---|
| Thermal conductivity | 5.5 W/m·K | Hot Disk |
| Thermal impedance | 0.05 K·cm²/W | ASTM D5470 / 40 psi |
| Viscosity | <400,000 cP | Listed as BF CVE #7 in source |
| Stated operating temperature | <110°C | Product presentation specification page |
| Formulation | Silicone-free | As described in supplier product material |
Source: KT-X9 technical presentation (260318), pp. 6, 11 and 15. Page 11 reports 0.05 at 40 psi; page 15 lists a general specification of <0.06. These values are retained in their respective contexts. Actual thermal performance depends on bond-line thickness, pressure, surface condition and system design.
THERMAL EVALUATION WORKSPACE
Put your conditions
into the evaluation.
Use reported impedance values to estimate the temperature drop across the interface alone.
01 / CONDITIONSKT-X9
50 W600 W
Only the two source test pressures are offered; no interpolation is used.
02 / INTERFACE ESTIMATEP × Z / A
°C
Estimated interface temperature drop ΔT
Reference impedance Z0.05 K·cm²/W
Interface resistance Z / A0.0050 K/W
A simplified one-dimensional steady-state estimate, not a CPU temperature or full-system simulation. Assumes uniform contact and all specified heat flow through the interface; excludes heatsink, ambient, spreading resistance and aging.
APPLICATION FOCUS
Different applications. Different requirements.
High power and thermal cycling
Share device power, heatsink contact area, clamping force and thermal cycling range to assess interface impedance and pump-out risk.
RELIABILITY EVIDENCE
Stability needs evidence over time.
Interface performance under cyclic load
The original chart covers 100 cycles, with 3 minutes burn-in / 3 minutes idle, and identifies an Intel Core i5 4300U. It supports discussion of pump-out and temperature change.
Supplier chart labels are retained. Confirm the detailed setup and original report during technical evaluation.
PRODUCT EVALUATION
Bring your thermal requirements.
Power, pressure, bond-line thickness
and temperature are a starting point.
Need the current TDS, SDS or a sample evaluation? Share your application and test requirements to discuss suitable grades and supply terms.
Start with your application.
Tell us about your material requirements, operating conditions and validation goals.